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Description
This material was written to help those who have either a need to know or would like to know about how surface mount products are assembled. We start off explaining the difference between batch and inline processes. Next we delve into the make up of solder paste, stencils, printing paste and finally all about reflowing. Whether you are new to SMT or have been doing it for a while you will learn a lot of sound basic information.
Table of Contents
There are five sections: Intro to Assembly of Electronic Products; Solder Paste Basics; Stencil Basics; Printing; and Reflow Profiles.
There are many items presented in this course that can help. The first section details what line configurations would look like all the way through final assembly. In the next section solder paste is broken down into its basic parts so you can understand terms like slump, handling and storage requirements. Stencils gets into the different types and how they are made then details about apertures sizes and shapes, the frames, handling and proper cleaning. Printing presents how to prepare for printing, contact vs non-contact methods, frames sizes, print head types, scavenging, blade pressures, angles, print misalignment, smearing, cleaning and more. Reflow profiles are where the board and solder are heated to achieve the melting of the solder. Improper profiles can result in component and or board damage so it is critical to understand what each step of a profile does and how best to accomplish it. You will learn about cracked capacitors, control limits, tombstoning, voids, other problems and the solutions.
Author: James C. Blankenhorn
Edition: 1995
ISBN#: 1-882812-31-X
Pages: 148 full color 8.5”x11”