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Check Cart/Check Out Our industry is making one of its most challenging and evolutionary steps in going from SnPb to Pb free products. The issues are many and they must be well understood to avoid costly mistakes or misspoken statements. In this course you will learn the most critical pieces about the transition to Pb free. It is the most extensive and broadest coverage of this topic available anywhere. The transition to Pb free first starts with understanding the directives and global trends. Then learn about the possible alloy replacements, their pros and cons along with the environmental considerations and reliability; each backed up with testing and data. The PWB finishes are dealt with in detail covering a wide range of optional finishes. That is followed by what the effects are of intermixing different board finishes, PWB plating types and solder alloys: addressing both forward and backward compatibility. Next, another important topic, tin whiskers are explained in a detail not seen anywhere else. Now you are only half way through! The next section gets into failure modes such as CAF, causes and solving tombstoning and voids, Pb free printing issues, Pb free reflow profiles (old compared to new recommendations) and how they relate to a variety of defects during reflow that can be solved by making slight changes. Learn what Motorola gained from extensive testing such as drop tests. Finally one more very important topic is covered, wave soldering. It covers topics such as tin pest, tin corrosion, fluxing, setup and the optional pin in paste process. Table of Contents Price: $295.00 Authors: Dr. Ronald C. Lasky, PhD, PE
Pages: 235 pages printed in full color
Indium Corporation, Dartmouth College Katherine Hickey, MEM, EIT Neovention, Dartmouth College Amish Peevasharn MS, EIT Neovention, Dartmouth College  |
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