Table of Contents
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Table of Contents
Chapter 1 Basics of High Speed & Switching This chapter starts off defining what a high-speed signal is, where they are used and on what kinds of conductors, how high-speed impacts products, terms necessary to present and understand high-speed such as risetime. Next, how analog compares as well as what a signal is made up of, the harmonics, frequency and time domain values, velocity and finally what a transmission line actually is. Chapter 2 Substrate Materials & Fabrication The successful design, when high-speed circuits are present, must focus on the materials the signals have to transmit through. In this section information is presented about board material, dielectric constant values, the effects of frequency, core material types and thickness, prepreg and thickness, resin, moisture effects, copper foil, fabrication panels, layer stack-ups, fabrication process, copper weight and resistance, copper losses, test coupons and TDR measurements. Chapter 3 Packages & Connectors In this section information is presented about SMT package lead capacitance and inductance, why they can be detrimental, smaller package advantages, the trend towards smaller packages, using BGA's, uBGA's, MCM’s, SOC’s, mixing technologies, lower profile packages, propagation delay reductions, higher frequencies in the future, reduction in supply voltage trends, decoupling, different types of connectors and controlled impedance, power and ground connections. Chapter 4 Semiconductor Devices The material presented in this section includes information about driver characteristics, device inputs and their characteristics, timing problems, trends in semiconductors, high-speed semiconductors, RF devices, types of digital most used, risetime, supply voltage vs. risetime, propagation delay vs. supply voltage, Vcc and ground bounce, typical driver characteristics, future performance, internal terminators, power and ground leads, decoupling, about decoupling caps and their contribution. Chapter 5 Transmission Lines & Differential Pairs Transmission lines are all around us. In this section learn what a transmission line is, optimum impedance, the effects of laminate and frequency on impedance, reactance formulas, reflections, load separation, lump and radial loading, microstrips, their use and the equations for, imbedded microstrips, their use and its equations. Next stack-up options for the layers are presented followed by information about differential pairs in broadside and edge coupled structures. Chapter 6 Layer Stack-ups The Chapter deals with the design characteristics of a printed circuit board. Topics include trace width, why stack-ups are important, common design mistakes, internal caps, thickness, hole and pad sizes, 2-layer, 4-layer, 6-layer, 8-layer and 10-layer boards and stack-ups presenting the pros and cons for the possible choices. Chapter 7 Decoupling & Power Distribution The design of the power distribution system is a critical step in the design process to prevent noise from entering through or being created by the power system. In this section information is presented about decoupling caps and their characteristics, planning planes, low and high frequency return pathways, switching transients, possible splitting of planes, bulk capacitance, ferrite beads and more. Chapter 8 Coupling & Parallelism Coupling primarily is determined by spacing between lines. When signals are routed close to one another there can be a sharing of radiated pulse energy that can cause problems. In this section information is presented about the fields for switching, what is coupling and the types, types of inductive coupling, source and victim, factors affecting inductive coupling, forward and backward crosstalk, parallelism, capacitive coupling, symmetrical and asymmetrical stripline inductive coupling, embedded micro-strip coupling, crosstalk tolerance and management. Chapter 9 Impedance Control & Reflections When nets on a design equal or exceed the transition length reflections will be created. In this section this matter is dealt with. There are instances when reflections are intended and useful, others where reflections are calculated and determined if they can be tolerated, and still others where reflections will create serious problems. Each of these instances shall be presented and dealt with. TTL/CMOS as loads, stubs, when stubs are shorts and how to calculate, effects of changing dielectrics, terminators, coupling problems, and ground traces around sources. Chapter 10 RF & Analog Design Considerations Understanding the sensitivity of analog on FR-4 or other materials, the effects of the loss tangent on signal amplitude and phase distortion, and the effects showing up on digital circuits are each covered in this important section. Also learn more about copper deposition and its effects on velocity, and dielectric constants of new materials for analog. Chapter 11 Terminators & Buses This section contains information on a typical circuit, circuits that do not need termination, short interconnects, net length analysis, reflections, critical nets, parallel terminator, types, location and design, matching terminator to line, series terminator value and location, mid-terminators, terminating differential pairs, terminating backplanes, handling bus lines, and packages for terminators. Chapter 12 Noise Margins & Budgets Understanding noise margins are key to determining how much noise can be tolerated. In this section information is presented about common symptoms, device families, noise sensitive devices, output drive vs. input voltages, noise margins, noise budget, calculating noise margins, multiple devices on a net, noise due to reflections, crosstalk, other factors affecting noise budget, planes, circuit failures, and solving noisy system design problems.. Chapter 13 EMI EMI is of major concern in high speed products. Knowing who regulates EMI, where it comes from and how to prevent it are presented. Also learn about wave impedance, the two forms of EMI, what radiates, the different modes, and most important is ways to control EMI. Chapter 14 Setting Up Design Rules This section presents information about setting up design rules, the type of circuitry, optimum impedance, rules for selecting trace width, determining fundamental and third harmonic bandwidth frequencies, transition and critical length, stub length, placement, sequential nets, handling sequential nets, routing, handling nets and termination, double-driven nets and termination, center drive nets and termination, connectors on nets, analyzing designs after routing. Chapter 15 Design Preparation & Documentation In this section information is presented about the steps in design, worse case possibilities, BGA part impact, determining layer count, assigning layers, net design rules, package selection impact, test structures, trace widths and spaces, parallelism rules, routability, cable connections, critical net noise, net routing, stub use, schematic changes, and implementing terminators. The latter portion presents about fabrication panels, documentation requirements for fabrication, notes test coupons checking stack-ups and concludes with a checklist useful in setting up for a high speed design.  |
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