Onsite Training
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Solder Training - Trainer Certification Course
Soldering is a combination of skill and knowledge. In this course on the first day, students will be trained and tested using the latest in computer based training tools developed by SMT Plus. There are eight modules with an exam after each module. Two days are then spent in lab soldering through-hole and SMT assemblies that are reviewed and graded. Upon successful completion of this course you will receive a two year certification. Who Would Benefit: This course is excellent for all skill levels including technicians, rework/repair, QA/QC and production personnel. Experience in soldering is helpful, but not mandatory. Course Outline - Day One, Lecture: Terminology of Soldering Applicable terms are explained in detail for boards, soldering and packages used in SMT. Terms such as lands, pads, FR-4, termination, lead pitch, eutectic, reflow, intermetallic, fillets, wetting, oxidation and TCE are explained. Basics of Soldering Soldering has been around for a long time, but few really have understood what happens in the process. Information such as where to contact, heat transfer, thermal shock, 3T's of soldering, steps for soldering and desoldering are all presented. Solder, Flux and Cleaning The use of flux, what it does and how it can affect the final product are vital to reliability. Topics covered include:
Tips have gotten smaller and are more like surgical instruments. Learning how to handle and care for them is critical to getting the best results and keeping the costs of replacement tips down. Information covered includes:
The proper use of each tip shape now that there are a range of types is important. Shapes discussed include straight, bent hook, knife, hoof, mini-hoof, slot, tunnel and quad tips. The details are presented on how to identify tip temperatures, tip uses, cleanup and tip contact points. Component Soldering The soldering of SMT components requires the proper tip, temperature and technique. Information will over all the steps including inspecting leads, polarity, tack solder points, correct tips and techniques. Component Desoldering The removal or desoldering of a component must not damage the boards. Understanding tip shape, preparation and techniques are key to doing it successfully. Inspection and Defects Once the soldering task is completed, there could be repair and inspection needs. In this module, the affect on functional performance by changes, inspection methods, inspection needs, identifying defects and recording, over-inspecting and corrective actions are covered. Course Outline - Day Two, PTH Soldering: A two board kit will be assembled during the session. Components include axial resistors and capacitors, electrolytics, radial capacitors and transistor. Demonstrations and practice will also include desoldering and damaged board repair. Course Outline - Day Three, SMT Soldering: During this lab a SMT board with a wide assortment of components will be assembled. Components include chips, tantalums, SOTs, SOICs, QFPs, PLCCs, sockets and fine pitch. Demonstrations and practice will include desoldering and damaged land repair. Course Materials: TechEdge SMT and Fine Lead Repair Rework Interactive, Multi Media CD-ROM Instructor: James C. Blankenhorn  |
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