Onsite Training
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BGA Design
BGA technology is a new area that is having an impact upon us. The strive to achieve high speed, manage parts with more heat, and do all this in less area has lead to a lot of interest in BGA Technology. But to be successful with this technology we must fully understand it and know where it is the best solution for our application. This new course is an excellent source of information for learning about BGA technology and how to successfully implement it. The information contained within this course will be helpful in understanding the packages, their advantages and disadvantages, designing using BGA, and process for assembly using BGA parts, BGA Technology reliability data, testing techniques, and how to do repair of both the assemblies and the BGA packages. To master The BGA technology begins with the packages themselves. BGA components can be in a variety of package options that are covered in this publication including CBGA/CCBGA, TBGA and PGA. The lead spacing covered are .060, .050, .040, and .025 and for the micro, Mini or super BGA packages. For designers information about pad geometrics, routing, layer requirements, power planes, solder mask requirements, CTE differentials and more are reviewed. For the design and manufacturing engineer the impact upon processing is included for stencils, solder paste, printing, placement, reflow in air with nitrogen and inspection are included. Who Would Benefit This course is a must for R and D, engineering, and technicians that may be considering or are using BGA components. Course Outline: New High Density Technologies
Instructor: James C. Blankenhorn  |
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